Samsung Electronics, one of the largest supplier of memory technology in the world, has begun mass production of their LPDDR5 UFS-based multichip package (uMCP) smartphone memory solution. These chips combine both LPDDR5 DRAM with the latest UFS 3.1 NAND flash, to provide improved memory performance for a wide-range of smartphones. With both DRAM and NAND … Continue reading "Samsung Multichip Package combines LPDDR5 and UFS 3.1 offering flagship experience on mid-range phones"
Wednesday, 16 June 2021
Samsung Multichip Package combines LPDDR5 and UFS 3.1 offering flagship experience on mid-range phones
Samsung Electronics, one of the largest supplier of memory technology in the world, has begun mass production of their LPDDR5 UFS-based multichip package (uMCP) smartphone memory solution. These chips combine both LPDDR5 DRAM with the latest UFS 3.1 NAND flash, to provide improved memory performance for a wide-range of smartphones. With both DRAM and NAND … Continue reading "Samsung Multichip Package combines LPDDR5 and UFS 3.1 offering flagship experience on mid-range phones"
