In the latest development, Samsung Electronics announced its next-generation 2.5D packaging technology Interposer-Cube4 (I-Cube4) for high-performance applications. What is I-Cube? Samsung’s I-Cube is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.), and several High Bandwidth Memory (HBM) dies on top of a silicon interposer making multiple dies operate … Continue reading "Samsung introduces I-Cube4 packaging tech for faster and more efficient chips"
Friday, 7 May 2021
Samsung introduces I-Cube4 packaging tech for faster and more efficient chips
In the latest development, Samsung Electronics announced its next-generation 2.5D packaging technology Interposer-Cube4 (I-Cube4) for high-performance applications. What is I-Cube? Samsung’s I-Cube is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.), and several High Bandwidth Memory (HBM) dies on top of a silicon interposer making multiple dies operate … Continue reading "Samsung introduces I-Cube4 packaging tech for faster and more efficient chips"
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The Optimus L4 II E440 owners may also want to keep their device up-to-date. So we thought of giving you a tutorial of how to upgrade Opt...
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Vivo launched the vivo V17 smartphone late last year in India with a Super AMOLED display, 32MP in-screen camera, and more. The successor t...
