Realme X50 5G with dual punch-hole display, Snapdragon 765G, liquid Cooling, VOOC 4.0 to be announced on January 7

After teasers, realme today confirmed that it will introduce the realme X50 5G will be introduced at an event in China on January 7th. This will be the company's first 5G smartphone. It already confirmed that it will be powered by the latest Snapdragon 765G with built-in 5G modem and will be available through major Chinese carriers. It also comes with dual punch-hole display. The invite shows sleek side profile of the phone with curved corners and in two different blue colors. The phone will come with support for 5G stand alone and non-stand alone (SA/NSA) sub-6GHz networks. The phone will feature 8mm 410mm³ diameter large  liquid-cooled copper tube for heat dissipation 3.0 offering five-dimensional heat dissipation that covers all the heat sources 100%. It will feature enhanced VOOC flash charge 4.0,  so that the phone is charged from 0 to 70% in 30 minutes. We should know more details about the phone in the coming days as we get closer to the launch date. Source