Advertisements

Monday, 25 February 2019

Qualcomm QCA6390 connectivity chipset with 1.8Gbps WiFi 6, Bluetooth 5.1 announced

Qualcomm Technologies has announced the Qualcomm QCA6390 Connectivity SoC at the MWC 2019. It is aimed at providing superior Wi-Fi and Bluetooth performance for mobile and computing devices. It is also the world's first 14nm integrated SoC to support the full feature suites of both Wi-Fi 6 and Bluetooth 5.1. The QCA6390 is built on MU-MIMO and 8-stream sounding and features Wi-Fi 6 certifiable mobile SoC. Qualcomm Technologies’ enhanced implementation of Wi-Fi 6 features in the QCA6390 deliver differentiation with superior connection speed, efficiency, range, power consumption, security, and more. It supports up to 1.8Gbps throughput speeds, 1024 QAM - higher order modulation across 2.4 and 5 GHz bands combined with Dual-Band Simultaneous (DBS) operation. The 8-Stream sounding is an essential mechanism that allows Wi-Fi 6 mobile and computing devices to take full advantage of the growing base of 8x8 MU-MIMO Wi-Fi 6 Access Points being commercially deployed. OFDMA and MU-MIMO Qualcomm Technologies multi-generational, field-proven capabilities extend beyond competitive solutions to improve spectral efficiency, capacity and help ensure seamless experiences across congested networks. The 14nm process node combined with advanced power-management architecture provides up to 50% improvement in power efficiency, compared to previous generation solutions. Target Wake-up Time (TWT) – Qualcomm Technologies’ implementation supports up to ...